发明名称 |
Semiconductor wafer plating cell assembly |
摘要 |
A new cell assembly for semiconductor wafer electroplating in the plated-side-up configuration utilizes a narrow passageway around the perimeter of the wafer through which solution is forced so as to provide the laminar flow needed for effective Damascene copper plating. In addition, use of a cylindrical insulating cell wall whose inside diameter matches that of the wafer area being plated avoids overplating of the wafer periphery. Anode isolation in a compartment separated via a solution transport barrier prevents introduction of particulates and holds anolyte in place during wafer changes. This cell assembly is readily amendable to automated wafer plating.
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申请公布号 |
US2003085118(A1) |
申请公布日期 |
2003.05.08 |
申请号 |
US20010012079 |
申请日期 |
2001.11.02 |
申请人 |
INNOVATIVE TECHNOLOGY LICENSING, LLC |
发明人 |
TENCH D. MORGAN;WHITE JOHN T. |
分类号 |
C25D5/08;C25D7/12;H01L21/288;H01L21/60;(IPC1-7):C25C7/00;C25B9/00;C25D17/00 |
主分类号 |
C25D5/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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