发明名称 Circuit board fitted or for fitting with components, has shape memory alloy element(s) that adopts imposed shape depending on temperature to deform board
摘要 The circuit board (1) has at least one element (4) made of a shape memory alloy that adopts an imposed shape depending on the temperature and with whose change in shape the circuit board can be deformed. The whole circuit board consists of a flexible material or it has rigid sections connected by flexible connecting sections. AN Independent claim is also included for the following: a method of manufacturing an inventive device.
申请公布号 DE10151242(A1) 申请公布日期 2003.05.08
申请号 DE20011051242 申请日期 2001.10.17
申请人 SIEMENS AG 发明人 KAUTZ, STEFAN;ZEININGER, HEINZ
分类号 H05K1/00;H05K3/00;(IPC1-7):H05K1/02;H05K13/00 主分类号 H05K1/00
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