发明名称 |
Circuit board fitted or for fitting with components, has shape memory alloy element(s) that adopts imposed shape depending on temperature to deform board |
摘要 |
The circuit board (1) has at least one element (4) made of a shape memory alloy that adopts an imposed shape depending on the temperature and with whose change in shape the circuit board can be deformed. The whole circuit board consists of a flexible material or it has rigid sections connected by flexible connecting sections. AN Independent claim is also included for the following: a method of manufacturing an inventive device.
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申请公布号 |
DE10151242(A1) |
申请公布日期 |
2003.05.08 |
申请号 |
DE20011051242 |
申请日期 |
2001.10.17 |
申请人 |
SIEMENS AG |
发明人 |
KAUTZ, STEFAN;ZEININGER, HEINZ |
分类号 |
H05K1/00;H05K3/00;(IPC1-7):H05K1/02;H05K13/00 |
主分类号 |
H05K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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