| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an epoxy resin composition which has a shorter curing time and a lower curing temperature than those of existing prepregs. SOLUTION: This matrix resin composition is characterized by containing (a) an epoxy resin having two or more epoxy groups per molecule on the average, and (b) 2,4-di(N,N-dimethylureide)toluene as essential components, and satisfying either of conditions (i) and (ii). (i): When the matrix resin composition is heated at 150 deg.C for 3 min, the product has a glass transition temperature of >140 deg.C. (ii): When the matrix resin composition is heated at 80 deg.C for 5 h, the product has a glass transition temperature of >100 deg.C. The obtained prepreg can reach a 95% cured state at a time of about a half in comparison with the prepreg in which only a used catalyst is different. In addition, when a prepreg using the epoxy resin composition is cured at 80 to 150 deg.C, the cured prepreg can be taken out from a mold without cooling the cured prepreg, because the glass transition temperature of the cured prepreg is higher than the curing temperature.</p> |
