ADHESIVE SHEET FOR WORKING SEMICONDUCTOR WAFER

摘要

PROBLEM TO BE SOLVED: To provide an adhesive sheet for working semiconductor wafers with which the grinding of a wafer to an extremely thin thickness is possible without bending the wafer at the time of grinding the rear surfaces of thin wafers and large diameter wafers and the resulting extremely thin wafer can be desirably transported. SOLUTION: The sheet is characterized by comprising a substrate having a stress-relaxation film and a rigid film laminated thereon and an energy beam curing type adhesive layer formed on one surface of the substrate.