CURABLE COMPOSITION FOR FORMING PROTECTIVE FILM, METHOD FOR FORMING PROTECTIVE FILM AND PROTECTIVE FILM

摘要

PROBLEM TO BE SOLVED: To provide a curable composition for forming a protective film capable of providing the protective film having various excellent physical properties even when the protective film is formed at a temperature not higher than the deformation temperature or discoloration temperature of a resin substrate, the protective film and a method for forming the protective film. SOLUTION: This curable composition comprises (A) a copolymer of (a1) an unsaturated carboxylic acid and/or an unsaturated carboxylic acid anhydride, (a2) an epoxy group-containing unsaturated compound and (a3) an olefinically unsaturated compound other than the monomers (a1) and (a2), (B) an epoxy resin other than the component (A) and (C) a compound capable of producing an acid with heat or radiations. The protective film is formed from the curable composition. The method for forming the protective film comprises coating the top surface of the resin substrate with the curable composition and then carrying out heat and/or light treatment. The treatment is carried out at a temperature without exceeding 180 deg.C.