发明名称 |
Ceramic waferboard |
摘要 |
An optoelectronic module includes a ceramic waferboard having a groove configured to passively position an optical fiber. The ceramic waferboard includes an alignment feature configured to passively position an optical component. An optical device is secured to the ceramic waferboard in contact with the alignment feature to thereby position the optical device. An optical fiber is positioned in the groove with an end of the optical fiber positioned adjacent the optical device to thereby optically couple the optical fiber to the optical device. The optoelectronic module also includes an integrated circuit chip secured to the ceramic waferboard, and a conductive material disposed on the ceramic waferboard and electrically coupling the integrated circuit chip to the optical device.
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申请公布号 |
US2003086652(A1) |
申请公布日期 |
2003.05.08 |
申请号 |
US20010015914 |
申请日期 |
2001.11.02 |
申请人 |
BOUDREAU ROBERT A;TAN SONGSHENG |
发明人 |
BOUDREAU ROBERT A;TAN SONGSHENG |
分类号 |
G02B6/36;G02B6/42;(IPC1-7):G02B6/30 |
主分类号 |
G02B6/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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