Process for bonding a diamon substrate to at least one metallic substrate

摘要

The method of bonding a diamond substrate to a metal substrate involves (a) subjecting a diamond substrate, covered with aluminium foil on one or both faces, to thermocompressive bonding under argon or vacuum to form a composite multilayer substrate; (b) placing the or each aluminium surface of the multilayer substrate in contact with a metal substrate; and (c) carrying out a second thermocompressive bonding operation.