发明名称 |
MULTILAYERED POLYMERIC STRUCTURE |
摘要 |
A multilayered polymeric structure having at least two polymeric layers is provided, each layer being a mixture of a polymeric composition with carbon fibrils. The multilayer polymeric structure may include an electrically conductive material between the first and second polymeric layers. A process for making a multilayered polymeric structure for packaging electronic components is also provided. The multilayered polymeric material is used to form trays and packages for containing electrical components. |
申请公布号 |
EP1307339(A1) |
申请公布日期 |
2003.05.07 |
申请号 |
EP20010952865 |
申请日期 |
2001.06.14 |
申请人 |
HYPERION CATALYSIS INTERNATIONAL, INC. |
发明人 |
FRIEND, STEPHEN O.;BRYANT, EDWARD, W., S.;FOWLER, HAROLD C. |
分类号 |
B65D1/00;B32B7/02;B32B27/18;B32B27/20;B32B27/36;B65D65/40;B65D85/86;C08K3/04;C08L101/00;H01B1/24;H05K9/00;(IPC1-7):B32B5/16;B65D85/00;H01B1/18 |
主分类号 |
B65D1/00 |
代理机构 |
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代理人 |
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