发明名称 METHOD AND APPARATUS FOR TREATING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To efficiently carry out the substitution of a liquid on a substrate to be treated in flat flowing system. SOLUTION: A liquid A on a substrate G, which is delivered from a treating part of the preceding stage, is swept out to the side or the side direction by the flow of a rinse liquid B by supplying the rinse liquid B from a V-shaped nozzle 160 on the surface-to-be treated of the substrate G transported in horizontal attitude in a transporting passage 114 to flow in the oblique direction to the transporting direction. In more detail, the surface-to-be-treated on the substrate G is divided left and right two parts, the liquid is passed to the left direction from the left nozzle part 160L of the V-shape nozzle 160 in the left half region and the liquid is passed to the right direction from the right nozzle part 160R of the V-shaped nozzle 160 in the right half region to efficiently sweep out the liquid A present on each part of the substrate.
申请公布号 JP2003126764(A) 申请公布日期 2003.05.07
申请号 JP20010329241 申请日期 2001.10.26
申请人 TOKYO ELECTRON LTD 发明人 KUBO RYOJI;AOKI MASAYA;NAGATA HIROSHI;SHINOZAKI MASAYA
分类号 G02F1/13;B05C5/00;B05C11/08;B05D1/26;B05D1/30;B05D3/00;B08B3/02;G02F1/1333;H01L21/027;H01L21/304;(IPC1-7):B05D1/30;G02F1/133 主分类号 G02F1/13
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