| 摘要 |
A semiconductor device includes four input terminals (INa1, INa2, INb1, INb2), four leads (2a, 2b, 2c, 2d) extending from the corresponding input terminals (INa1, INa2, INb1, INb2) and a semiconductor chip (3) that has a first circuit and a second circuit and is mounted on one of the leads (2c). The lead (2c) having the semiconductor chip (3) thereon bends in a plane of the substrate (1) so that an end portion and a mid portion of the lead (2c) are exposed on one side of the semi-conductor chip (3). One of the input electrode pads (Ia2) of the first circuit is connected to the end portion of the lead (2c) by a bonding wire (4). The end portion of the lead (2c) is on the opposite side of the mid portion of the lead (2c) with respect to one of the leads (2b) that is connected to one of the input electrode pads (Ib1) of the second circuit by a bonding wire (4). This configuration achieves a crossing wiring structure within the packaging. By changing the connection of bonding wires, the crossing wiring structure is easily undone. |
