| 摘要 |
An integrated circuit chip 1 has resin moulded semiconductor device and bonding wires connected to external connection lands disposed at the bottom surface of the chip 4. Those connection lands at the corners 4a have an enlarged area, allowing a larger amount of solder 22 to adhere compared to other lands, so that the four corners of the integrated circuit chip are firmly soldered to lands 21 of a mother board 20. In one embodiment a BGA-type chip has a grid of solder balls adhered to the connection lands between the chip and mother board. In a second embodiment a BCC-type chip has a grid of conductor terminals (fig 5; 11) have connection lands (fig 5; 14) at the bottom, those at the corners having enlarged area. |
