Process for the manufacture of a wiring for contact holes

摘要

Production of a wiring comprises forming contact holes in an insulating layer (2) to form a first wiring layer (1); cleaning one surface of the contact holes; forming a barrier layer (4) on the surface of the contact holes; forming an AlGeCu-containing second wiring layer (5) on the surface of the insulating layer using a low pressure PVD process to fill the holes; forming and structuring a mask layer (7); and structuring the second wiring layer using the mask layer in an anisotropic etching process. Preferred Features: The second wiring layer is formed by depositing a AlGeCu layer at substrate temperatures of more than 100 degrees C. The cleaning step is carried out using a wet chemical process and/or a plasma etching process. An antireflection layer made of titanium nitride is formed on the surface of the second wiring layer.