| 摘要 |
In a method of frame plating, an electrode film for plating is formed on a base layer of a plating layer to be formed. Next, a resist layer is formed on the electrode layer. The resist layer is exposed to beams for exposure through the use of a mask. Next, the resist layer exposed is developed and the portion exposed is removed to form a resist frame, such that the angle theta between an inner wall of the resist frame and the bottom surface thereof exceeds 90 degrees. Next, heat treatment is performed on the resist frame, such that the angle theta becomes 90 degrees or smaller. Next, plating is performed with the electrode film as the seed layer through the use of the resist frame having gone through the heat treatment. The plating layer is thereby formed.
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