| 摘要 |
PROBLEM TO BE SOLVED: To promote thinning of an IC card and also improve the productivity of the IC card in a method for producing the IC card. SOLUTION: The process of heating and cooling a laminate S for which an IC chip and a thermoplastic adhesive material are clamped between a pair of resin sheets and adhering the resin sheets is composed of a first process for vacuuming the periphery of the laminate S while clamping and heating the laminate S between temporary laminating press plates 14a and 14b set at a first temperature, a second process for clamping and heating the laminate S between main sticking press plates 22a and 22b set to a temperature equal to or above the softening point of the thermoplastic adhesive material and a third process for clamping the laminate S by cooling press plates 30a and 30b set at the temperature lower than the softening point of the thermoplastic adhesive material and cooling it. That is, by clamping it by the respective press plates set to the respective prescribed temperatures, the laminate S is promptly heated and cooled. |
