发明名称 Mikroelektronische Vorrichtung
摘要 1,165,854. Encapsulated electronic assemblies. FRIDEN Inc. 25 April, 1968 [15 May, 1967], No. 19518/68. Heading B5A. [Also in Division H1] An assembly of integrated circuit clips 10, Fig. 3, embedded in a block 20 of cast encapsulating material with their surfaces, provided with terminal pads (16), Fig. 1 (not shown), exposed and the terminal pads interconnected by conductors 28 overlying the surface of the block 20, is formed by casting encapsulating material in a mould in which the individual clips are arranged with their surfaces against one face of the mould and subsequently removing the one face of the mould to expose the terminal pads of the clips so that conductors can be formed on the surface of the block. As described the clips comprise a substrate (12), Fig. 1 (not shown), of semi-conductor material having operative elements 14, e.g. transistors, diodes and resistors, and terminal pads 16 formed thereon. Each clip may be bonded to a metal pin 22 of, e.g. gold-plated alloy of nickel and iron, acting as a heat sink. The clips are located face downwards on a glass plate (32), Figs. 6-8 (not shown), backed by a mirror (31), using a microscope (38), the required positions of the clip and the mould walls on the plate having previously been marked, e.g. by etching, on the surface of the plate. The clips and mould walls are held in position before encapsulating by an adhesive, e.g. a silicone material in a solvent or carnauba wax. The encapsulating material may be a ceramic, e.g. magnesium carbonate or a silicon dioxide material or an epoxy resin which may have a mineral filler. After the material has set and the glass plate removed, the interconnection conductors may be applied by sputtering alternating insulating 50, 56 and conductive 53-55, 58, 59 layers, Fig. 13, of silicon dioxide and aluminium on to the block, the sputtered materials being limited to selected areas by photo-resist techniques. Alternately insulating areas of glass and conductive areas of cermets may be applied as paint or ink through screen stencils.
申请公布号 DE1766392(A1) 申请公布日期 1971.07.22
申请号 DE19681766392 申请日期 1968.05.13
申请人 THE SINGER CO. 发明人 FRANCIS HINCHEY,JOHN
分类号 H01L23/538 主分类号 H01L23/538
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