| 摘要 |
An electroconductive adhesive to which a luminescent heterocyclic compound, especially a benzoxazol, is added. The ratio of the heterocyclic compound in the adhesive, which preferably is a silver-charged, epoxy-resin adhesive, is 0.01% to 0.5% by weight. The adhesive is especially suitable for bonding electrical components to circuit carriers where automated process control is employed.
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