| 摘要 |
A multilayer printed board compound comprises at least two planely superposed printed boards, each of which having an electrically insulating mother board, electrically conductive circuit paths, which are provided on at least one side of the mother board, and recesses, which are defined laterally by the circuit paths and towards the mother board by the mother board; and at least one preimpregnated board, which is disposed between the printed boards for joining the printed boards; wherein the recesses, which are disposed between the mother boards of the respective printed boards, are filled substantially entirely with a synthetic resin paste; and wherein the at least two printed boards and the at least one preimpregnated board are joined by pressing.
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