| 摘要 |
A semiconductor device of one chip has a first power supply terminal allowing connection with an external power supply IC, a second power supply terminal allowing connection with the external power supply IC, a main voltage dropping circuit connected with the first power supply terminal, a secondary voltage dropping circuit connected with the second power supply terminal, and an internal circuit connected with the main voltage dropping circuit and the secondary voltage dropping circuit. A high voltage of the external power supply IC is received in the main voltage dropping circuit through the first power supply terminal and is dropped. The high or low voltage of the external power supply IC is received in the secondary voltage dropping circuit through the second power supply terminal and is dropped. The internal circuit is operated by using the dropped voltage obtained in the main or secondary voltage dropping circuit.
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