发明名称 Fixing apparatus for heat sink
摘要 A fixing apparatus includes a retention module (30), four rivets (10), and a back plate (50). The retention module is attached on a motherboard (60), the motherboard defining four orifices (62) therein. The retention module defines four through holes (31) therein. The back plate is attached on an underside of the motherboard, for reinforcing the motherboard. The back plate defines four apertures (52) therein. Four posts (34) depend from the retention module through the orifices and the apertures. A bore (36) is defined through each post, and in axial alignment with a corresponding through hole. The rivets are inserted through the through holes and the bores such that the posts are firmly engaged with the motherboard and the back plate.
申请公布号 US6560112(B1) 申请公布日期 2003.05.06
申请号 US20020052280 申请日期 2002.01.17
申请人 HON HAI PRECISION IND. CO., LTD. 发明人 SZU MING-LUN;MAR HAO-YUN
分类号 G06F1/20;H01L23/40;(IPC1-7):H05K7/20 主分类号 G06F1/20
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