| 摘要 |
A circuit pattern is formed with an electrically conductive paste composed by mixing electrically conductive fillers, the shapes of which have aspect ratios, and a magnetic material, a shape of which has an aspect ratio, in a resin 4. In addition, a circuit pattern is formed with complexes 10 of electrically conductive fillers, the shapes of which have aspect ratios, and a magnetic material 2, and the circuit pattern 21 is hardened while a magnetic line of force is applied in the thickness direction of the circuit pattern 21.
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