发明名称 Test pattern for evaluating a process of silicide film formation
摘要 The present invention relates to a semiconductor device, and more particularly, to a test pattern for evaluating a process of silicide film formation. The test pattern in accordance with the present invention includes: a silicon substrate having an active region and a field region; a first pattern composed of a cross resistor pattern of a polycide layer formed on the field region; and a second pattern composed of polycide layer and a silicide layer formed on the active region. The second pattern includes: a pair of polycide patterns composed of a first polycide strip and a second polycide strip extended in parallel, being spaced from each other a predetermined interval on an insulating film formed on the active region; and an active silicide strip formed between the first polycide strip and the second polycide strip.
申请公布号 US6559475(B1) 申请公布日期 2003.05.06
申请号 US20000704760 申请日期 2000.11.03
申请人 HYUNDAI ELECTRONICS INDUSTRIES CO., LTD. 发明人 KIM JONG-CHAE
分类号 H01L21/66;H01L21/3205;H01L23/52;H01L23/544;(IPC1-7):H01L23/58;G01R27/08;G01R31/26;G01R27/26 主分类号 H01L21/66
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