发明名称 Micromechanical structure
摘要 The invention relates to a micromechanical structures that include movable elements. In particular the invention relates to an arrangement for coupling such movable elements to other structures of a microelectromechanical system (MEMS). The invention is characterized in that the arrangement comprises at least one coupling means (930-936) for coupling the movable element to the fixed structure, and at least one flexible means (980, 990-996) for allowing different thermal expansion between the movable element and the other structure in the direction which is substantially perpendicular to the characteristic movement of the movable element, wherein said coupling means and/or flexible means is reinforced in the direction of the characteristic movement of the movable element.
申请公布号 US6557413(B2) 申请公布日期 2003.05.06
申请号 US20010967429 申请日期 2001.09.28
申请人 NOKIA MOBILE PHONES LTD. 发明人 NIEMINEN HEIKKI;RYHAENEN TAPANI;ERMOLOV VLADIMIR;SILANTO SAMULI
分类号 B81B3/00;(IPC1-7):G01P15/00 主分类号 B81B3/00
代理机构 代理人
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