| 发明名称 |
Process for forming fusible links |
| 摘要 |
A process for forming fusible links in an integrated circuit includes forming the fusible link in the last metallization layer. The process can be employed in the fabrication of integrated circuits employing copper metallization and low k dielectric materials. The fusible link is formed in the last metallization layer and may be formed simultaneously with the bonding pad areas.
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| 申请公布号 |
US6559042(B2) |
申请公布日期 |
2003.05.06 |
| 申请号 |
US20010894337 |
申请日期 |
2001.06.28 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BARTH HANS-JOACHIM;BURRELL LLOYD G.;FRIESE GERALD R.;STETTER MICHAEL |
| 分类号 |
H01L21/3205;H01L21/768;H01L21/82;H01L23/52;H01L23/522;H01L23/525;H01L27/10;(IPC1-7):H01L21/320;H01L21/326;H01L21/331;H01L21/44 |
主分类号 |
H01L21/3205 |
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