发明名称 |
Chip scale packaging on CTE matched printed wiring boards |
摘要 |
A circuit assembly (10) has a heat sink assembly (12) and a chip scale package assembly (14). The chip scale package assembly (14) has an integrated circuit die (24) coupled to a first printed wiring board (22). The heat sink assembly (12) has a heat sink (16) coupled to a second printed wiring board (18). Preferably, the heat sink assembly (12) and the chip scale package assembly (14) are assembled separately then assembled together. The circuit pads (32) on the first printed wiring board (22) correspond with circuit pads (20) on the second printed wiring board (18). The circuit pads (32, 20) may be coupled together by solder or adhesive bonding. The circuit pads (32) on the first printed wiring board (22) may have solder balls (34) formed of high temperature solder that do not melt when the heat sink assembly (12) is assembled with chip scale package assembly (14). The solder balls (34) allow chip scale package assembly (14) to maintain a predetermined distance from the circuit pads (20) on the second printed wiring board (18) (Fig. 1). <IMAGE> |
申请公布号 |
EP1126752(A3) |
申请公布日期 |
2003.05.02 |
申请号 |
EP20010101762 |
申请日期 |
2001.01.26 |
申请人 |
THE BOEING COMPANY |
发明人 |
LO, CHING PING;HUANG, DANIEL, A.;HUDSON, PETE |
分类号 |
H05K3/32;H01L21/60;H01L23/14;H01L23/498;H05K1/02;H05K1/05;H05K1/18;H05K3/00;H05K3/34;H05K7/20 |
主分类号 |
H05K3/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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