| 摘要 |
By performing an accurate cutting when a substrate is cut, a gap between the substrates when a plurality of substrates are arranged is made constant or is reduced or eliminated, thereby improving electric characteristics of the gap portion between the substrates. For this purpose, a slice line and a guide line are provided on the substrate, the substrate is cut along the slice line, and the guide line is detected upon cutting, thereby detecting a misalignment and cutting the substrate while correcting the misalignment.
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