| 摘要 |
In a semiconductor device, at the time of resin sealing by using a package member, a conductor is disposed in a loop so that its apex is at almost the same level as that of a surface (mounting face on which a cooling device is to be mounted) of the package member, thereby forming a contact terminal as contacting means. With the configuration, a semiconductor device capable of knowing deterioration in cooling efficiency of the cooling device by a method other than a method of detecting a temperature rise in the semiconductor device can be provided.
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