| 摘要 |
There is provided methods for producing an ultrasonic transducer assembly. T he methods generally comprise the steps of creating a multi-layered rigid or flexible printed circuit board (10), having a top surface and bottom surface ; creating a patterned conducting layer upon each of the top and bottom surfac e; creating at least one patterned backplate electrode (22, 40) on the board or as part of a discreet component which is then attached to the board (10); creating at least one conductive through-hole via (16, 20) integral with the board; roughening at least a portion of each of the at least one backplate (22, 40) to introduce gas pockets in that portion of a surface of the backplate (22, 40); and attaching thin insulating or dielectric single or multi-layer film (26) on a portion of the board in which the film has an integral conducting surface (28) and in which the conducting surface (28) is configured so as to form a capacitive structure with the at least one backplate (22, 40). |
