Semiconductor device, semiconductor package, electronic device, and method for establishing information processing environment

摘要

An electronic device is provided on which semiconductor packages can be mounted efficiently. The electronic device includes a board that can receive a plurality of first semiconductor packages each carrying a processor device and a plurality of second semiconductor packages each carrying a memory device. Mount regions where the packages are to be mounted and non-mount regions are alternately arranged in rows and columns on the board. This ensures approximately equal wiring distances between the packages, allowing processor devices to access associated memory devices at the same time.