| 摘要 |
A method of forming fiber arrays includes using a base substrate to form an alignment pattern, holding a fiber fixed with reference to the pattern, and, while the fiber is held fixed, bonding a cap to the fiber, the cap being of a material having a different coefficient of thermal expansion than the base substrate. The base substrate can be an etched silicon chip and the cap can be of a fused silicon material. The method provides one and two dimensional arrays of fibers, the fiber aligning structures of the arrays having coefficients of thermal expansion selected to match those of connecting components. A fiber array made by the method includes a pair of substrates, a fiber sandwiched between the substrates, and a molded material holding the fiber in a predetermined alignment with respect to a pattern preformed in the molded material.
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