发明名称 |
CARRIER HEAD FOR CHEMICAL MECHANICAL POLISHING |
摘要 |
A new designed carrier head for chemical mechanical polishing is disclosed. The carrier head has a non-rigid incision ring having a downwardly-projecting non-rigid incision and surrounding a support plate of the carrier head instead of conventional incision or rip disposed in a conventional support plate. The carrier head also has a flexible membrane extending around the edges of the support plate, wherein the edge of the flexible membrane is at predetermined distance from the incision.
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申请公布号 |
US2003079836(A1) |
申请公布日期 |
2003.05.01 |
申请号 |
US20020119676 |
申请日期 |
2002.04.11 |
申请人 |
LIN JUEN-KUEN;CHEN TZU-SHIN;LAI CHIEN-HSIN;WEI YUNG-TSUNG |
发明人 |
LIN JUEN-KUEN;CHEN TZU-SHIN;LAI CHIEN-HSIN;WEI YUNG-TSUNG |
分类号 |
B24B37/04;H01L21/306;(IPC1-7):C23F1/00;H01L21/461;H01L21/304;H01L21/302 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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