发明名称 Electronic component and method of manufacturing the same
摘要 In an electronic component, an element section is formed on a base, and the element section has functions of at least one of inductance, resistor, and capacitor. Resist film is formed on at least the lateral faces of the base. An unnecessary part of patterned resist film is removed, and a protective member is formed on that removed place. Then remaining resist film is removed. This manufacturing method can provide the electronic component excellent in bonding strength between the protective member and the base.
申请公布号 US2003079904(A1) 申请公布日期 2003.05.01
申请号 US20020260544 申请日期 2002.10.01
申请人 SATO SATOSHI;FUJIMARU TAKUYA;IZUMI YASUHIRO;YONEDA YOSHITO;TABARU YASUNORI;KIYOMURA YOSHIHIRO 发明人 SATO SATOSHI;FUJIMARU TAKUYA;IZUMI YASUHIRO;YONEDA YOSHITO;TABARU YASUNORI;KIYOMURA YOSHIHIRO
分类号 H01C1/028;H01C17/06;H01F17/00;H01F27/02;H01F27/29;H01F27/32;H01F41/04;H01G4/06;H01G4/33;H01G4/40;(IPC1-7):H05K3/02;H01B5/14;H05K13/00 主分类号 H01C1/028
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