| 摘要 |
The present invention provides a surface acoustic wave (SAW) device. The SAW device provides a SAW die made from a piezoelectric material and has an active region. The active region has metallized and interdigitated electrodes attached to it. The interdigitated electrodes are attached to metallized I/O pads on the SAW die. The SAW device also provides a substrate having top substrate pads on a first surface thereof and bottom substrate pads on an opposing surface thereof and vias filled with a conductive material to electrically connect the top substrate pads to the bottom substrate pads. Also provided are means for attaching the SAW die to the substrate, the means having a size and shape such that it surrounds the active region of the SAW die and hermetically seals the active region of the SAW, and means for electrically connecting each top ubstrate pad to a corresponding I/O pad.
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