BAKE APPARATUS AND WAFER MANUFACTURING METHOD USING THE SAME

摘要

PURPOSE: A bake apparatus and a wafer manufacturing method using the same is provided to minimize the duration of temperature instability by using two control mode of a controller. CONSTITUTION: A wafer(130) is loaded on a heat plate(120) for baking the wafer(130). The heat plate(120) is enclosed by an oven cover(110) for reducing thermal loss. A plurality of support pins(140) are installed on the heat plate(120) for loading or unloading the wafer(130) from the heat plate(120). A temperature detecting part(150) is installed in the heat plate(120) for sensing the temperature of the heat plate(120). A controller(170) is located at the outer portion of the heat plate(120) for supplying power to the heat plate(120) and controlling the temperature of the heat plate(120). At this time, the controller(170) is provided with the first control mode(172) for heating the heat plate(120) to the established temperature of a baking process and for remaining the established temperature, and the second control mode(174) for heating the heat plate(120) to the rising temperature.