发明名称 High frequency printed circuit board via
摘要 A printed circuit board (PCB) via, providing a conductor extending vertically between microstrip or stripline conductors formed on separate layers of a PCB, includes a conductive pad surrounding the conductor and embedded within the PCB between those PCB layers. The pad's shunt capacitance and the magnitudes of capacitances of other portions of the via are sized relative to the conductor's inherent inductance to optimize frequency response characteristics of the via.
申请公布号 US2003080835(A1) 申请公布日期 2003.05.01
申请号 US20020308612 申请日期 2002.12.03
申请人 FORMFACTOR, INC. 发明人 HREISH EMAD B.;MILLER CHARLES A.
分类号 H03H7/075;H03H7/01;H03H7/38;H05K1/02;H05K1/11;H05K1/16;H05K3/34;H05K3/42;(IPC1-7):H01P5/02 主分类号 H03H7/075
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