| 摘要 |
A method of manufacturing an electronic device is provided comprising the steps of providing a circuit having at least one cantilever lead (310), providing a die having at least one bonding region (330), bonding the at least one cantilever lead to the at least one bonding region (330), and bending the at least one bonded cantilever lead (355). Preferably, the electronic device comprises an inkjet cartridge. |
