| 摘要 |
A chip interface assembly and method of assembling a chip interface provide enhanced performance. The chip interface assembly includes a semiconductor package and a socket. The semiconductor package has a female contact architecture, where the female contact architecture is mated with a male contact architecture of the socket. By reversing the traditional male/female arrangement of conventional interconnection interfaces, difficulties associated with signaling throughput, clearance, hardware complexity and electrical losses can be obviated. |
