WIRING BOARD SHEET AND ITS MANUFACTURING METHOD, MULTILAYER BOARD, AND ITS MANUFACTURNG METHOD

摘要

A wiring board sheet which enables the miniaturization of a wiring board by mounting electric components 10 in an insulation layer 4 to increase the quantity of mounting electric components, has a high reliability, and undergoes a complicated manufacturing process, and a method for manufacturing the wiring board sheet. A multilayer board which is mannufactured from this wiring board sheet, eliminates a difference in thermal histories during molding in each layer, simplifies the manufacturing process, and realize miniaturization by the scale-down and high-density of a conductor circuit and an improvement in reliability, and a method for manufacturing the multilayer board.