| 摘要 |
PURPOSE: A method is provided to allow for formation of fine holes and achieve improved speed of hole formation, while reducing costs and contaminant. CONSTITUTION: A method comprises a step of exposing the portion of a printed circuit board(10) where holes or grooves are to be formed, by removing a metal coated layer(11) through a chemical solvent etching method; a step of disposing the printed circuit board in the environment having a low pressure and an electric field of a constant intensity, and injecting gases such that the gases are excited and decomposed into unstable particles, permitting the resin existing in the holes or grooves to chemically react on the excited gases such that the resin has a low molecule and is converted into a gas state, and discharging molecules of gas state at a low pressure condition such that the unstable particles etch the resin, to thereby perform a plasma etching process; and a step of completely forming fine holes by dissolving the glass fiber which is not removed by the plasma etching process, through the use of a chemical solvent.
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