| 发明名称 |
Solid sheet material especially useful for circuit boards |
| 摘要 |
A solid sheet which contains an nonwoven fabric made from short high tensile modulus fibers and a thermoplastic polymer having a low moisture absorption matrix resin that is useful as a substrate for circuit boards.
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| 申请公布号 |
US2003082974(A1) |
申请公布日期 |
2003.05.01 |
| 申请号 |
US20020227997 |
申请日期 |
2002.08.26 |
| 申请人 |
SAMUELS MICHAEL R.;KHAN SUBHOTOSH;LEVIT MIKHAIL R. |
发明人 |
SAMUELS MICHAEL R.;KHAN SUBHOTOSH;LEVIT MIKHAIL R. |
| 分类号 |
C08J5/04;B29B13/10;B32B15/04;B32B15/08;B32B27/12;H05K1/03;(IPC1-7):D04H5/00;D04H1/00;D04H13/00;D04H3/00 |
主分类号 |
C08J5/04 |
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