| 发明名称 |
Device package and device encapsulation method |
| 摘要 |
In a device encapsulation method, an organic EL device is formed on a substrate. An encapsulation cap is placed on the substrate to surround the device and thereafter an end face of the cap is welded on at least the substrate. A device package is also disclosed.
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| 申请公布号 |
US2003080679(A1) |
申请公布日期 |
2003.05.01 |
| 申请号 |
US20020314600 |
申请日期 |
2002.12.09 |
| 申请人 |
ISHII IKUKO;SAKAGUCHI YOSHIKAZU |
发明人 |
ISHII IKUKO;SAKAGUCHI YOSHIKAZU |
| 分类号 |
H05B33/04;H01L51/50;H01L51/52;H05B33/12;H05B33/14;(IPC1-7):H05B33/00 |
主分类号 |
H05B33/04 |
| 代理机构 |
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