| 摘要 |
A soldering apparatus for soldering a printed wiring board, including a solder vessel for containing a molten solder, a nozzle disposed in the vessel and having a first opening and a second opening, and an electromagnetic pump secured in the vessel and including a tubular member defining a solder flow path therein and having an inlet and an outlet connected to the second opening of the nozzle. The pump has cores and coils disposed at a position below the surface level of the molten solder and arranged to generate a moving magnetic field in the path when the coils are electrically energized, so that the molten solder is fed from the inlet to the outlet and is projected from the first opening of the nozzle to form a solder wave.
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