| 摘要 |
<p>The invention provides a chemical-mechanical polishing system comprising an abrasive, a carrier, andeither boric acid or a conjugate base thereof, wherein the boric acid and conjugate base are not presenttogether in the polishing system in a sufficient amount to act as a pH buffer, or a water-solubleboron-containing compound or salt thereof that is not boric acid, and a method of polishing a substrateusing the chemical-mechanical polishing system.</p> |
