SOLDER PREVENTING METHOD FOR PRINTED CIRCUIT BOARD

摘要

PURPOSE: A solder preventing method for a printed circuit board is provided to reduce manufacturing procedures and costs, while preventing the printed circuit board from being warped by the stresses. CONSTITUTION: A solder preventing method comprises a step of forming a solder preventing material(3) and an aluminum thin film(2) on one or both sides of a printed circuit board(1) on which an electrical circuit is arranged, wherein the solder preventing material has a coefficient of thermal expansion similar to the coefficient of thermal expansion of the printed circuit board; a step of solidifying the semi-solid solder preventing material by attaching the aluminum thin film and the solder preventing material on the printed circuit board by applying a constant pressure to the aluminum thin film and leaving the resultant structure at a predetermined temperature for a predetermined time period; a step of exposing the copper to the outside by removing the aluminum thin film formed on the copper disposed on the printed circuit board and removing the solder preventing material formed on the copper; and a step of removing the aluminum thin film from the solder preventing material through the use of a chemical solvent.