发明名称 APPARATUS FOR FORMING THIN FILM OF SEMICONDUCTOR DEVICE
摘要 PURPOSE: An apparatus for forming a thin film of a semiconductor device is provided to be capable of measuring the mass of a wafer before and after a thin film formation process by adding electronic scales to the apparatus. CONSTITUTION: An apparatus for forming a thin film of a semiconductor device is provided with a loading and unloading zone(50), a photoresist coating zone(52) installed with a photoresist coating apparatus(53), a development zone(54) installed with a development apparatus(55), an interface zone(56), and an exposure zone(58) installed with an exposure apparatus(59). The loading and unloading zone(50) includes a loading and unloading stage(64,68) located at one side of the loading and unloading zone(50), and the first and second electronic scale(62,66) installed on the lower portions of the loading and unloading stage(64,68), respectively. A development stage(74) is located between the photoresist coating zone(52) and the development zone(54). The third electronic scale(72) is installed on the lower portion of the development stage(74).
申请公布号 KR20030033414(A) 申请公布日期 2003.05.01
申请号 KR20010065174 申请日期 2001.10.22
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHO, HYEONG SEOK
分类号 H01L21/00;(IPC1-7):H01L21/00 主分类号 H01L21/00
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