| 摘要 |
An epoxy composition including an epoxy resin, a latent amine curing agent, and a specific catalyst. Preferably, the epoxy resin includes two epoxide groups per molecule, and the latent amine curing agent is a dicyanopolyamide, most preferably, dicyandiamide. The specific catalyst is preferably 2,4-toluene bis dimethyl urea. A prepreg employing the epoxy composition of the present invention can achieve a 95% cure in about one half of the time required by a prepreg that differs only in the catalyst employed. Furthermore, prepregs employing the epoxy composition of the present invention have glass transition temperatures higher than the curing temperatures when cured at a temperature range from about 80° C. to about 150° C., enabling cured prepregs to be removed from molds without being cooled. Use of the prepregs of the present invention thus enables composite component manufacturers to substantially increase production rates without requiring the use of additional molds.
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