发明名称 CIRCUIT FORMATION BY LASER ABLATION OF INK
摘要 <p>There is disclosed a method of forming conductive tracks on a substrate using a laser ablation technique in order to produce Printed Circuit Boards (PCBs). The method involves the initial step of coating a substrate such as alumina substrate (16) with a conductive ink to create a conductive ink layer (20). Subsequent to this, a laser spot (24) is focussed onto the ink (20) in order to ablate a portion of the ink layer (20) from the substrate (16) to define tracks of ink (32), which are then cured. Also disclosed is a method of forming multiple layers of conductive tracks on a substrate, each layer of conductive tracks being separated by a layer of cured dielectric ink. The method involves and sequentially coating, ablating, and curing alternate dielectric and conductive ink layers on a substrate incorporating cured tracks of ink produced by the method noted above. An apparatus for use in the method is also disclosed.</p>
申请公布号 WO2003037049(A1) 申请公布日期 2003.05.01
申请号 GB2002004713 申请日期 2002.10.17
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