SURFACE TREATMENT FOR COPPER FOIL

摘要

A surface treatment which can make copper foil improved in the tight adhesion to insulating resins.This treatment comprises as the active ingredients an organosilicon compound represented by the general formula(1)and/or one represented by the general formula(2)and an olefinic silane coupling agent.The treatment can improve the tight adhesion between copper foil(particularly low−profile copper foil for substrates of high−frequency applications)and an insulating resin.(1)(2)In the above formulae,R1 is hydroxyl or C1−5 alkyl and R2 is C1−10 alkylene which may contain an oxygen atom.