| 摘要 |
PURPOSE: A process technology of lead-free soldering is provided which not only enables mass production, but also increases reliability of product by reducing process defective proportion. CONSTITUTION: In lead-free soldering a product, the process technology of lead-free soldering comprises printing step of injecting nitrogen having oxygen concentration of 1,000 ppm (parts per million) using a pack during printing of lead-free solder; mounting step of mounting electronic components on a PCB (printing circuit board) on which the lead-free solder is printed; and soldering step of soldering the PCB on which the electronic components are mounted by maintaining proper temperature of 170 to 180 deg.C and time of 100 to 120 seconds in nitrogen reflow and maintaining oxygen concentration of 2,500±300 ppm when injection of nitrogen into the nitrogen reflow.
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