| 摘要 |
Corrosion inhibiting method of Cu and Cu alloys wherein a chemically coverted film is formed on the metal surface by contacting the surface with a solution containing 2-undesilimidazol at a temperature between 0 to 100 degrees C. The 2-undesilimidazol has the formula of: where R is H or lower alkyl and HA is an (in)organic acid. Salts which are adaptable in practising the invention are those of acetic acid, capric acid, glycolic acid, paranitro benzoic acid, paratoluene sulphonic acid, picric acid, succinic acid, maleic acid, fumaric acid, tartaric acid, adipic acid, chloric acid, sulphuric acid, phosphoric acid, lactic acid, and oleic acid. |
