| 摘要 |
A semiconductor device and its manufacturing method with which the conductive balls can be prevented from falling off. In terms of the configuration, semiconductor chip 100 is mounted onto the principal surface of insulated substrate 102, and solder balls 108 serving as external connection terminals are mounted on the rear surface. Insulated substrate 102 has via holes 112 to fill with solder paste for mounting solder balls 108. Via holes 112 contain internal channels 304 on inner peripheral surface 302 in order to exhaust the gas generated when the solder is melted to the outside.
|
